Manufacturing Capabilities

What We Build

From prototype to production — every process, every material, every standard.

PCB Fabrication

Technical Specifications

Manufactured to IPC-A-600 Class 2/3. 100% AOI and electrical test on every board.

PCB stackup diagram
ParameterStandardAdvanced
Layer Count2–16 layers18–32 layers
Board Thickness0.4mm–3.2mm0.2mm–6.0mm
Min Trace / Space5/5mil3/3mil
Min Mechanical Hole0.25mm0.15mm
Min Laser Via0.10mm0.075mm
Impedance Control±10%±5%
Max Board Size500×600mm600×800mm
Copper Weight1oz–3oz0.5oz–6oz
HDI Type1+N+1, 2+N+2Any-Layer
Solder MaskGreen, Blue, Black, White, Red, Yellow — LPI
SilkscreenWhite, Black, Yellow — Legend print
Surface FinishENIG, OSP, HASL (Lead-free), Immersion Silver, Immersion Tin, ENEPIG, Hard Gold
Base MaterialsFR-4, High-Tg FR-4, Rogers 4350B/4003C, PTFE (Taconic/Arlon), Aluminum, Ceramic (Al₂O₃/AlN), Polyimide
Special ProcessesBack-drill, Counterbore, Edge Plating, Carbon Ink, Peelable Mask, Gold Fingers (30μ")

PCBA Assembly

Assembly Excellence

PCBA assembly process
ParameterCapability
SMT Lines8 high-speed lines (Yamaha YSM20R / ASM Siplace)
Daily Capacity8,000,000 placements / day
Min Component0201 (0.6×0.3mm)
Min BGA Pitch0.3mm
Max PCB Size500×600mm
Component TypesBGA, QFN, QFP, SOP, SOIC, PLCC, LGA, CSP, PoP, 01005
DIP Lines4 wave-soldering lines (Lead-free)
InspectionSPI (Solder Paste), AOI (Pre & Post-Reflow), X-Ray (BGA/QFN), ICT, FCT
Conformal CoatingAcrylic, Silicone, Urethane — Selective spray / Manual brush
Acceptance StandardIPC-A-610 Class 2 & Class 3

Materials

The Right Substrate

Every application demands a different material. We stock 20+ laminate types.

PCB material comparison

FR-4

Standard Tg 130–140°C. Cost-effective for consumer electronics and general-purpose applications.

High-Tg FR-4

Tg 170–180°C. Superior thermal stability. Automotive, industrial, and lead-free assembly compatible.

Rogers

Low Dk/Df. High-frequency RF/microwave. 5G, radar, satellite communication.

Aluminum

Thermal conductivity 1.0–3.0 W/m·K. LED lighting, power supplies, motor drives.

Ceramic

Al₂O₃ / AlN. Thermal cond. 20–170 W/m·K. High-power RF, aerospace, extreme environments.

PTFE

Ultra-low Dk (2.1–2.9). Microwave, millimeter-wave. Taconic / Arlon equivalents.

Polyimide

Flex and rigid-flex. High temp resistance. Aerospace, medical, wearable devices.

Mixed Laminates

Hybrid stack-ups for cost-performance optimization. FR-4 + Rogers, FR-4 + PTFE.

Application Showcase

Where Our Boards Perform

Automotive PCB application

Automotive Electronics

IATF 16949 certified manufacturing for ADAS control units, battery management systems, engine ECUs, and infotainment platforms. AEC-Q100 qualified component sourcing.

  • AEC-Q100 compliant
  • 1,000-cycle thermal shock tested
  • PPAP Level 3 documentation
Medical PCB application

Medical Devices

IPC Class 3 assembly for diagnostic imaging, patient monitoring, and therapeutic devices. Full traceability with lot-level records maintained for 10 years.

  • IPC-A-610 Class 3
  • Full lot traceability
  • Cleanroom assembly available
Industrial control PCB

Industrial Control

Heavy copper (up to 6oz) for high-current motor drives, PLCs, and power supplies. Conformal coating for harsh environments. -40°C to +125°C operating range.

  • 6oz heavy copper
  • Conformal coating (acrylic/silicone/urethane)
  • Extended temperature testing
Telecom PCB application

Telecom & 5G Infrastructure

High-frequency Rogers and PTFE laminates for base stations, antenna arrays, and optical transceivers. Controlled impedance ±5% for signal integrity at GHz frequencies.

  • Rogers 4350B/4003C in stock
  • Impedance ±5% with TDR verification
  • Back-drill / blind via for signal integrity

Have a Technical Requirement?

Send us your specs. Our engineering team reviews every inquiry and responds with DFM feedback within 24 hours.

Online Estimator