Blog
Technical articles on PCB design, manufacturing, and industry best practices. Written by our engineering team.
Only the first two are real constraints. When a designer asks for a 0.05 mm dam over a trace routing channel, they are usually asking for something that carries no process risk
Five variables decide how much force a joint will hold, and only one of them is controlled by the fabricator. The others are set by the design and by the connector the buyer
This page sets out the capillary mechanism that decides penetration, the gap heights at which each chemistry stops moving, a package-by-package verdict including the cases where
What a printing defect costs at SPI, AOI, ICT and in the field, a cost model you can run on your own volumes, and the four levers that move printing yield.
High-Tg FR-4 vs RF laminates vs metal-core: what each one changes, what it costs per square metre, the MOQ and lead-time penalty, and the cost of choosing wrong.
Test coverage matrix, fixture NRE break-even by volume, and the cost of an escaped defect: how to choose between ICT, FCT, flying probe and boundary scan without over-testing.
Dross is not a fixed cost of wave soldering. How alloy, bath depth, skimming frequency and nitrogen move the dross rate, the numbers to demand, and the PO clause that caps it.
When a plastic enclosure needs metal threads — insert type, boss design, wall thickness and melt damage, and the per-unit cost trade against thread-forming screws.
Flux that has lost its activators looks identical to fresh flux. How to tell activator depletion from oxide, profile and contamination causes, and what to put in the PO.
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