Blog
Technical articles on PCB design, manufacturing, and industry best practices. Written by our engineering team.
Why a 0402 beats the same value in 0603 above 200 MHz, where parallel capacitors create an anti-resonance peak, and what a board shop can actually verify.
A stale hex file can scrap a whole lot. How firmware revision lock, verify coverage and panel-level programming are controlled in contract assembly.
DC-bias loss, voltage derating and ageing decide whether an MLCC survives. Plus what a contract manufacturer must measure on every incoming reel.
Selective coating eliminates masking but adds programming and cycle-time cost. Learn the break-even model, valve choices and the failure modes to control.
IPC-CC-830 qualifies a coating material, not your process. Learn the test set, the QC vs QPL distinction and the six documents to demand from a supplier.
ASTM E595 sets TML ≤1.0% and CVCM ≤0.10% for vacuum use. Learn which coating chemistries pass, and the bake-out and cure controls that keep them there.
Wave solder defects trace to five parameters, wave height and alloy condition. Learn the control windows and what to specify on a PO
Wrong or drifted solder alloy causes cold joints, icicles and RoHS failures. Learn how OES and XRF verification work and what to require from a supplier.
Escaped defects reach your line, not the supplier's scrap bin. Learn how to define escape rate, set DPMO acceptance on a PO, and audit AOI/ICT coverage gaps.
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