Blog — PCB Manufacturing Insights

Jetting vs Stencil Break-Even — Cost Model by Volume

Solder paste jetting vs stencil printing compared on tooling cost, a BOM-mix checklist and a hybrid-line strategy for prototype through pilot production

First Article Inspection for PCBA — The FAI Package Buyers Must Receive

First Article Inspection (FAI) for PCBA explained: what the first article must verify, the AS9102 vs industry-standard report formats, the dimensional

Agricultural Electronics Ruggedisation — Field-Ready PCBA for Farm Machinery

How to ruggedise agricultural electronics PCBA for the field: IP sealing, 12/24V load-dump and surge protection, 40 to +85C operation

PPAP for Conformal Coated Assemblies — The Coating Evidence Package

Conformal coating changes the PPAP evidence required. Thickness: coverage

PCB FMEA — What Process Failure Mode Analysis Must Cover

A PFMEA is the document that decides which PCB assembly risks get controlled and which get ignored. Here is what a credible PFMEA covers

8D Report & CAPA for PCBA — What a Real Corrective Action Looks Like

Most 8D reports stop at containment and call it corrective action. Learn how to read the eight disciplines, and what to require when a defect recurs

OEE on SMT Lines — How Buyers Should Read Utilisation Claims

OEE is easy to quote and easy to dress up. Learn which components of SMT line utilisation are auditable: which numbers inflate the figure

Electrochemical Migration on PCB Assemblies — Causes, Test Methods and Prevention

Electrochemical migration is the dendritic growth that shorts fine-pitch assemblies in humidity. Learn the ionic contamination and how to prevent it at DFM

Copper Wrap & Edge Plating — Board-Edge Reliability Rules Buyers Should Specify

Copper wrap protects the board edge from moisture ingress and handling damage. Learn when wrap plating is required: how to specify depth and thickness

Insights & Resources