Blog
Technical articles on PCB design, manufacturing, and industry best practices. Written by our engineering team.
X-out panels explained: how to specify x-out rules in your purchase order and what it costs to reject them
Solder voiding in BGA and thermal pads explained: how to measure void percentage and how to write it into your spec
How to build a PCBA test strategy: choosing between AOI, ICT, flying probe and functional test, setting coverage targets
PCB tolerance stack-up analysis explained: a worked connector-alignment example and the limits a fabricator can actually hold
Pad cratering is a resin crack under the copper pad: not a solder defect. Learn the thermal, material and design causes
Black pad syndrome explained: the nickel corrosion mechanism behind brittle ENIG solder joints, how microsection and ball shear detect it
How pin-in-paste reflow removes a soldering step: the paste volume maths, stencil aperture design, connector temperature limits and the defects to control.
Choosing a flux chemistry for PCBA: residue type: surface insulation resistance under humidity, the real cost of cleaning
Cavity and step-cavity PCB design: grounding and the cost drivers behind recessed and embedded features
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