Blog
Technical articles on PCB design, manufacturing, and industry best practices. Written by our engineering team.
Underfill is chosen for reliability and then blocks every repair. A practical guide to heat and mechanical removal: board-local rework limits, when to scrap
Jetting a board is not the same as qualifying the process. A practical qualification protocol for stencil-free solder paste deposition
Parylene thickness cannot be specified as one number. A practical guide to specifying thickness by location: mask scheme selection
How stencil aperture geometry controls solder paste release: area ratio and transfer efficiency maths, the step-stencil rules for fine pitch and connectors
Gerber files are your product. A practical guide to NDA scope: tooling ownership, controlled data transfer, counterfeit and clone risk, auditability clauses
How a contract manufacturer's OQC gate should be built: inspection basis, AQL sampling, the data pack a buyer should receive
Why tombstoning and head-in-pillow defects pass X-ray, what pad geometry and package warpage cause them, and the process controls that prevent both.
The eight solder paste printing defects that survive to reflow, the print parameters behind each, and the corrections that hold on a high-volume SMT line.
Which PCB test coupons to specify for impedance, microsection, solderability and reliability testing, and where they must sit on the panel to be meaningful.
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