Huaxing PCBA PCB manufacturing insights and articles

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Insights & Resources

Technical articles on PCB design, manufacturing, and industry best practices. Written by our engineering team.

Two-Phase Immersion Cooling PCB — Materials | Huaxing PCBA

How two-phase immersion fluid affects PCB laminates, cleaning limits and a supplier checklist for immersion boards

PCB for Thin-Film Deposition Equipment — Materials and Vacuum Survival

Outgassing classes: material selection and IPC Class 3 cleanliness for PVD, CVD and ALD control electronics. Supplier checklist for deposition tool OEMs

Probe Card & ATE Fixture PCB — Substrate Design | Huaxing PCBA

How pin count: pitch and impedance budgets drive probe card substrate fabrication, line width, layer count, via-in-pad

SPC & Cpk for PCBA — How to Tell Real Process Control from a Certificate

Which PCBA parameters need control charts: how to read X-bar and R chart limits, the Cpk 1.33 vs 1.67 threshold

PCB Cleanroom Classification — What Your Product Actually Needs

Which ISO 14644 cleanroom class each PCB process needs: where Class 7/6 is oversold, how particles cause field failures

IPC-2221 Design Rules — The Gap Between the Minimum and the Manufacturable

IPC-2221 conductor spacing, with the tolerances a Shenzhen fab actually holds in volume and an RFQ design-rule checklist

Solder Pallets & Process Carriers — Do You Actually Need Tooling?

Solder pallets and process carriers for wave and selective soldering: when tooling is mandatory, material choices, cost drivers

IPC-7351 Density A/B/C: Which Land Pattern to Use | Huaxing

IPC-7351B footprint density levels A, B and C explained for buyers and designers and how footprint choice drives solder defect rates

Gauge R&R & MSA for PCBA — Can You Trust the Inspection Data?

Gauge R&R and measurement system analysis for PCB and PCBA buyers: %GRR acceptance limits, how to request an MSA study on CMM and AOI data