Blog — PCB Manufacturing Insights

Thermal Via Arrays — Count, Fill & Copper Plane Rules

Thermal via array design rules for QFN and power packages: via count vs drill size, filled vs tented vias, thermal relief spokes

Solder Paste Rheology — Viscosity, Thixotropy, Slump | Huaxing PCBA

Solder paste printability depends on viscosity, metal content and slump rather than one viscosity figure. What each test measures and how to specify paste

Solder Mask Spec — LPI vs Dry Film, Thickness | Huaxing PCBA

How to specify PCB solder mask: LPI vs dry film vs UV ink, on-trace thickness for impedance and solder dams, registration tolerance

Conformal Coating Defects Orange Peel, Fisheye and Pinholes

Six conformal coating defects, the process parameter behind each, and the IPC-A-610 Class 2 and Class 3 accept/reject verdict. Includes PO clauses.

Coating Coverage Verification How to Prove a Board Is Actually Coated

How to specify and verify conformal coating coverage with UV tracer: keep-in zones, inspection limits, the thickness correlation trap, and testable PO wording

BOM and MPN Verification at Goods-In What Happens Before Your Parts Reach the Line

How goods-in BOM and MPN verification catches wrong part, wrong reel and counterfeit risk before SMT: what is checked, with what equipment, and what it costs.

IPC-A-620 Cable Harness Inspection — Class 2 vs Class 3

Crimp height, pull force and strand damage limits for IPC/WHMA-A-620 Class 2 and Class 3 plus what Class 3 adds to harness cost.

IP Rating for Electronic Enclosures — What IP67 Actually Requires

Decode IP65, IP66, IP67 and IP69K, see what each test involves, and learn the six sealing failure modes plus why IP67 does not stop condensation.

End-of-Line Functional Test — Coverage, Fixture Cost and Test Time

ICT, FCT, burn-in and system test compared by failure mode plus what drives FCT fixture cost and why test time is a hidden per-unit cost.

Insights & Resources