Huaxing PCBA PCB manufacturing insights and articles

Insights & Resources

Technical articles on PCB design, manufacturing, and industry best practices. Written by our engineering team.

IPC-6012 Qualification — Performance Requirements & Classes for Rigid PCBs

IPC-6012 Qualification — Performance Requirements & Classes for Rigid PCBs

IPC-6012 is the qualification and performance specification for the rigid board itself — not the assembly. Understand the Class 1/2/3 levels, the microsection,

Wire Harness & Cable Assembly — Box-Build Value-Add & Test Specification

Wire Harness & Cable Assembly — Box-Build Value-Add & Test Specification

How a PCBA supplier adds real value with wire harness and cable assembly in box-build: harness vs cable assembly vs loom, the 6 electrical tests that prove qual

Parylene Coating Guide — Thickness, Types & When It Beats Every Other Conformal

Parylene Coating Guide — Thickness, Types & When It Beats Every Other Conformal

Parylene is the conformal coating that copies the board atom by atom: learn Parylene C/D/N/F types, the thickness range that matters, how vacuum deposition work

PCB Storage & Moisture Control — IPC-1601, MSD/DSD Handling & Dry Packing Guide

PCB Storage & Moisture Control — IPC-1601, MSD/DSD Handling & Dry Packing Guide

How to store bare PCBs and assembled boards so moisture and corrosion never become a reliability problem: IPC-1601 storage rules, moisture sensitivity level (MS

Double-Sided SMT & Mixed-Technology PCB Assembly — Reflow Order, Stencil & THT Rules

Double-Sided SMT & Mixed-Technology PCB Assembly — Reflow Order, Stencil & THT Rules

Double-sided SMT and mixed-technology (SMT + through-hole) assembly done right: the reflow order for gluing vs no-gluing, how to handle the second side without

IPC-A-610 Conformal Coating Acceptance Criteria — Class 1/2/3 Inspection Limits, Thickness & Def

IPC-A-610 Conformal Coating Acceptance Criteria — Class 1/2/3 Inspection Limits, Thickness & Def

Exactly what IPC-A-610 says a conformal coated board must look like to pass: wet and dry film thickness ranges, void and pinhole limits per Class 1/2/3, coverag

PCB Via Aspect Ratio Limits: What Your Manufacturer Can Actually Plate & Drill

PCB Via Aspect Ratio Limits: What Your Manufacturer Can Actually Plate & Drill

Via aspect ratio is the single most common cause of a via failing a continuity or reliability test. Learn the drill and plating limits for through, blind and mi

PCB Edge Connector & Gold Finger Design: Card-Edge Plating, Wear & Inspection

PCB Edge Connector & Gold Finger Design: Card-Edge Plating, Wear & Inspection

Gold fingers and card-edge connectors are where a PCB meets the system — and where wear, corrosion and poor plating cause field failures. Learn hard gold vs sof

PCB Solder Joint Defects: Voids, Bridging & Cold Joints — How to Prevent and Inspect Them

PCB Solder Joint Defects: Voids, Bridging & Cold Joints — How to Prevent and Inspect Them

Solder joint defects are the #1 cause of PCBA field failures. Learn the root causes of voids, bridging, cold joints and tombstoning, the IPC-A-610 and J-STD-001

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