Capabilities / SMT Stencil
Framed and frameless stencils laser-cut from stainless steel, with electro-polished apertures and nano coating for paste release. Aperture design reviewed against your pad geometry before cutting — the cheapest place to fix a paste-volume problem.
Aluminium frame with mesh tensioned to 35–40 N/cm. The standard choice for high-volume lines and for printers that index by frame fiducial.
Foil only, with or without a tensioned border. Lower shipping cost and less storage space — the right call for prototyping and low-volume runs.
Stepped foil for mixed paste volumes on the same board — fine-pitch ICs needing less paste next to power pads needing more, without changing the aperture design.
Hydrophobic surface treatment that improves paste release and extends the cleaning interval. Measurably fewer paste bridges on 0.4 mm pitch and below.
We compare your aperture design against the pad geometry and paste volume your components need, and flag area-ratio problems before the stencil is cut.
0.10 mm for fine-pitch, 0.12–0.15 mm for general SMT, 0.20 mm for connectors and through-hole paste. We recommend per board, not per order.
| Parameter | Range | Notes |
|---|---|---|
| Foil material | 304 / 316L stainless steel | 316L for finer apertures and longer life |
| Foil thickness | 0.08 – 0.30 mm | Step stencils up to 3 levels |
| Min aperture | 0.08 mm | Below 0.10 mm requires 316L and nano coating |
| Aperture tolerance | ±5 µm | Measured by AOI on 100% of apertures |
| Max stencil size | 736 × 736 mm | Larger on request |
| Frame tension | 35 – 40 N/cm | Measured and recorded per frame |
| Lead time | 24 – 48 h standard | Same-day for repeat orders in Shenzhen |
Stencils are cut from the same Gerber set you send for fabrication — order them together and they ship in the same box as the boards.
Paste layer and board outline are enough for us to quote a stencil.