Blog
Technical articles on PCB design, manufacturing, and industry best practices. Written by our engineering team.
How to use SPI data to control solder paste volume, paste height specs and the process window that keeps a line in control
How to interpret SMT first pass yield correctly: yield definitions that differ between suppliers, benchmark ranges by product class
When nitrogen reflow is worth the cost: O2 ppm targets by component type, the solderability and wetting physics behind it
When stencil-free SMT beats stencils for NPI and prototype builds: tooling cost, changeover time, break-even volume, paste jetting and dispense options
How to evaluate a solder paste jetting machine, and a break-even cost model against stencil printing. For low-volume and high-mix SMT runs
How to calculate SMT line capacity correctly. OEE and bottleneck identification. A planning framework for buyers and manufacturing engineers
PCB silkscreen legend design rules: minimum line width and character height per IPC-2221, reference designator placement, polarity and pin-1 marks
PCB fiducial mark design rules: fiducial size and shape, solder mask clearance, global vs local fiducials, minimum placement from board edge
PCB depanelization methods compared: V-score vs tab routing vs laser cutting. Depth rules, edge quality, flexible board handling, cost and yield
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