Blog
Technical articles on PCB design, manufacturing, and industry best practices. Written by our engineering team.
Choose the right thermal interface material (TIM) for a power PCB: gap pad vs thermal paste vs phase-change vs liquid metal: thermal conductivity, thickness
Combine a low-loss RF laminate (Rogers) with economical FR-4 in a single stackup: Dk and Df fields, CTE matching, prepreg selection, layer ordering
Design the LAN magnetics module right: isolation transformer turns ratio, common-mode choke, 1500V isolation, creepage, Bob Smith termination
Solder-mask-defined (SMD) vs non-solder-mask-defined (NSMD) PCB pads, and which pad type to use for QFN, BGA, 0201 and power pads. A practical decision guide
QFN and LGA leadless package soldering: exposed thermal pad voiding, stencil aperture design to IPC-7525, reflow and wetting
CE marking for imported electronic products and how the Declaration of Conformity and technical file are put together for a finished unit
Warehouse and logistics automation PCBA: conveyor VFD drive control: parcel sortation crossbelt and tilt-tray controllers, ASRS high-bay shuttle control
Street and roadway LED lighting controller PCBA: high-line 277/347/480V input: lightning surge immunity to 10kV, power factor correction above 0.95
Cold chain and refrigeration electronics PCBA: pharmaceutical 2-8°C monitoring: inverter compressor control, defrost and condensation engineering
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