Blog
Technical articles on PCB design, manufacturing, and industry best practices. Written by our engineering team.
How to store bare PCBs and assembled boards so moisture and corrosion never become a reliability problem: IPC-1601 storage rules
Exactly what IPC-A-610 says a conformal coated board must look like to pass: wet and dry film thickness ranges, void and pinhole limits per Class 1/2/3
Double-sided SMT and mixed-technology (SMT + through-hole) assembly done right: the reflow order for gluing vs no-gluing
Via aspect ratio is the single most common cause of a via failing a continuity or reliability test. Learn the drill and plating limits for through
Solder joint defects are the #1 cause of PCBA field failures. Learn the root causes of voids: bridging, cold joints and tombstoning
Gold fingers and card-edge connectors are where a PCB meets the system: and where wear
Modern CPUs and GPUs push well past 700 W, and air cooling no longer moves that heat. Learn how cold-plate liquid cooling, any-layer HDI Shenzhen factory
DO-254 governs design assurance for airborne electronic hardware, from an IPC Class 3 factory
Designing a board for 112G or 224G SerDes is a channel problem: not a routing problem. Learn the insertion-loss budget, low-loss laminate selection
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