Huaxing PCBA PCB manufacturing insights and articles

Insights & Resources

Technical articles on PCB design, manufacturing, and industry best practices. Written by our engineering team.

PCB Trace Width & Current Capacity — IPC-2152 vs IPC-2221 Design Guide

PCB Trace Width & Current Capacity — IPC-2152 vs IPC-2221 Design Guide

Complete guide to PCB trace width calculation for current carrying capacity. IPC-2152 vs IPC-2221 comparison: copper weight vs trace width charts

PCB Microsection Analysis Guide — Cross-Section Testing for Plated Through-Hole & Solder Joint Quality

PCB Microsection Analysis Guide — Cross-Section Testing for Plated Through-Hole & Solder Joint Quality

Complete guide to PCB microsection analysis: cross-section preparation, potting, polishing, and microscope measurement of copper barrel thickness, IMC layer

PCB Ionic Contamination Guide — ROSE Testing, SIR Analysis & IPC Cleanliness Standards

PCB Ionic Contamination Guide — ROSE Testing, SIR Analysis & IPC Cleanliness Standards

Complete guide to PCB ionic contamination and cleanliness testing: ROSE (IPC-TM-650 2.3.25), SIR (Surface Insulation Resistance), ion chromatography

PCB Failure Analysis Guide — Root Cause Investigation & Cross-Sectioning

PCB Failure Analysis Guide — Root Cause Investigation & Cross-Sectioning

Complete PCB failure analysis guide, and solder joint reliability analysis. How to investigate PCB failures and prevent recurrence

PCB Depaneling Methods — Routing vs V-Scoring vs Laser vs Punching Compared

PCB Depaneling Methods — Routing vs V-Scoring vs Laser vs Punching Compared

Comprehensive comparison of PCB depaneling methods, and design rules for each method. How to choose the right singulation process for your PCB

PCB Counterfeit Detection Guide — Component Authentication & Supply Chain Traceability

PCB Counterfeit Detection Guide — Component Authentication & Supply Chain Traceability

How to detect counterfeit PCBs and electronic components: blacktopping visual inspection, X-ray internal comparison, decapsulation, XRF material verification

Lead-Free vs Leaded Solder — SAC305 Reliability & Tin Whisker Risk Compared

Lead-Free vs Leaded Solder — SAC305 Reliability & Tin Whisker Risk Compared

Data-driven comparison of lead-free (SAC305: SN100C) vs leaded (SnPb) solder for PCB assembly. Reliability testing results, tin whisker mitigation strategies

IPC-A-600 Accept vs Reject: What Inspectors Check | Huaxing

IPC-A-600 Accept vs Reject: What Inspectors Check | Huaxing

Complete IPC-A-600 acceptance criteria guide for PCB buyers. Class 1/2/3 inspection standards plus how to read inspection reports and verify supplier

USB-C PCB Design & Layout Guide — Impedance Control, ESD Protection & Power Delivery

USB-C PCB Design & Layout Guide — Impedance Control, ESD Protection & Power Delivery

Complete USB-C PCB design guide for hardware engineers: 90Ω differential impedance routing, SuperSpeed lane layout, ESD protection placement

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