Blog
Technical articles on PCB design, manufacturing, and industry best practices. Written by our engineering team.
IPC-A-610: J-STD-001, and IPC-6012 serve different purposes in PCB procurement. Learn which standard to reference on your PO, how they overlap
How to manage component obsolescence in PCB assembly: EOL forecasting, last-time buy calculations, BOM health scoring, and redesign strategies for industrial
Complete comparison of COB (Chip-on-Board): COG (Chip-on-Glass), and SMT assembly technologies. Learn when to use each, wire bonding, encapsulation
Compare ceramic (Al₂O₃, AlN): PTFE (Teflon), and polyimide PCB substrates, Dk/Df, thermal conductivity, Tg, cost, and application fit for RF, aerospace
How PCB design and manufacturing choices affect audio performance: substrate materials for low dielectric loss, ground plane design for noise isolation
Complete PCB signal integrity design guide covering crosstalk prevention, termination strategies, differential pair routing, return path design
MSL classification determines whether your PCBs survive reflow or delaminate from trapped moisture. This guide covers MSL levels 1-6: floor life
Complete buyer's guide to PCB incoming quality inspection. Visual checkpoints and how to set up an IQC process that catches 95% of issues before assembly
High-voltage PCB design guide covering IPC-2221 creepage and clearance requirements: CTI material selection, pollution degree classification
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