Blog — PCB Manufacturing Insights

UPS PCB Design — Inverter, Charger & Bypass Layout for Uninterruptible Power

UPS PCB design guide covering static bypass and heavy-copper thermal management for reliable uninterruptible power

LiDAR PCB Design — SPAD Arrays, High-Speed Data & Thermal Management

LiDAR PCB design guide covering high-speed point-cloud data paths and thermal management for automotive and robotics sensors

Access Control PCB Design — Multi-Door Controllers, PoE & Battery Backup

Access control system PCB design: multi-door controller layout, Wiegand and OSDP reader interfaces, electric lock outputs

PCB Hole Accuracy & Drilling Tolerance — Position, Size & IPC-6012 Limits

Drilled hole size: position accuracy and annular ring requirements explained, IPC-6012 tolerance classes

Filled Via & Via-in-Pad — IPC-4761 Via Fill Types & Reliability Guide

Copper-filled, resin-filled and conductive-paste vias explained: IPC-4761 types, via-in-pad rules, cost impact and DFM guidance for BGA and HDI boards.

IoT Positioning Module PCB Design — GNSS, UWB & BLE AoA Integration

Multi-radio positioning module PCB design: GNSS + UWB + BLE AoA coexistence, antenna separation, power integrity and RTLS hardware integration guide.

Solder Paste Jetting vs Stencil — Which to Choose

Solder paste jetting vs stencil printing, accuracy and lead-time comparison for prototype and low-volume PCBA. When zero-tooling SMT actually saves you money

PCB Underfill Guide — Capillary vs No-Flow Underfill for BGA, CSP & Flip-Chip

Underfill process guide for BGA, CSP and flip-chip: capillary vs no-flow vs molded underfill, material selection, void control and reliability testing.

Design for Assembly (DFA) — 10 Rules That Cut PCBA Cost & Rework

Design for Assembly (DFA) rules for PCBA: component selection, footprint design, panelization and test access choices that reduce assembly cost and rework.

Insights & Resources