Blog — PCB Manufacturing Insights

PoE PCB Design Guide — Power over Ethernet PD/PSE Layout, Isolation & 802.3bt Rules

PoE PCB design rules for powered devices and power sourcing equipment: 802.3af/at/bt power classes, isolation and creepage, magnetics placement

PCB Manufacturing Tolerances — Standard vs Tight: Etch, Drill, Registration & Impedance Limits

PCB manufacturing tolerances explained for design and procurement engineers: standard vs tight limits for trace width, drill, annular ring, registration

MEMS Sensor PCB Design — Layout, Grounding & Assembly Rules

MEMS sensor PCB design rules: accelerometer, gyroscope and pressure sensor layout, analog grounding, package selection

J-STD-001 Solder Assembly Standard — Process Requirements & Verification Levels for PCBA Buyers

J-STD-001 requirements for PCB assembly explained for buyers: what the 3 verification levels and 3 product classes actually change on your purchase order

Automotive Infotainment & Cockpit PCB Design — Display, EMC & Reliability Rules

Automotive cockpit and infotainment PCB design rules. CISPR 25 EMC, thermal and HDI manufacturing choices for 15-year automotive life

Wearable Medical Device PCB Manufacturing — Flex Circuits, Biocompatibility & Ultra-Miniaturization

PCB manufacturing for wearable medical devices: flex and rigid-flex circuits, biocompatible materials

VR & AR Headset PCB Design — HDI, Rigid-Flex & High-Bandwidth

Complete guide to VR and AR headset PCB design: any-layer HDI for 4K micro-displays, rigid-flex boards for the temple area, thermal management for 5W+ modules

SMT vs Through-Hole PCB Assembly — Component, Cost & Reliability Comparison

SMT vs through-hole PCB assembly compared: mixed-technology boards and how to choose the right process for your product

SMPS PCB Layout Guide — Switching Power Supply Design Rules

Switch-mode power supply PCB layout rules: critical loop minimization, inductor placement, sense-line routing, ground planes

Insights & Resources